Credits: 3 (3-0-0)
Description
Silicon wafer fabrication and oxidation techniques, Growth kinetics and oxide measurement techniques, defects in silicon and silicon dioxide, interface defects, polysilicon, silicon nitride and silicide formation, Lithography and etching techniques, diffusion and ion implantation, modeling and measurement of dopant profile, Thick and thin film device technology, Processes involved in ink preparation, screen printing, laser trimming, mounting, mask making and packaging, Thin film deposition, metallization, etc.